Shares of SK Hynix ballooned more than 6% in South Korea this morning (26th), lifting the KOSPI to a record high after the company unveiled its next-generation high-bandwidth memory technology, iHBM.

The new solution integrates a cooling component (ICE) into high-bandwidth memory (HBM) packaging, structurally addressing the most critical heat dissipation challenge faced by AI chips.

One of the key advantages of the new technology is improved product compatibility. Major tech clients such as NVIDIA Corporation (NVDA.US) can immediately adopt iHBM in their next-generation systems without significant standalone design modifications.

In Hong Kong, XL2CSOPHYNIX (07709.HK) last quoted at HKD110.75, up 14.15%, with turnover of HKD2.505 billion. XL2CSOPSMSN (07747.HK) last quoted at HKD158.95, up 4.5%.
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AASTOCKS Financial News
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