This morning (16th), Chief Executive John Lee unveiled the Policy Address and Hong Kong's first Five-Year Plan. Paired with the upcoming Fed rate decision, market stayed on the sideline. The HSI opened up 122 pts before once turning south by nearly 100 pts, then rebounded repeatedly to close at 24,713, up 46 pts or 0.19%. Main board turnover totaled HKD181.085 billion. The HSCEI closed at 8,206, up 1 pt or 0.02%, while the HSTECH closed at 4,325, up 34 pts or 0.79%.

Major techs came under pressure. TENCENT (00700.HK) and XIAOMI-W (01810.HK) each closed down about 1.2%. BIDU-W (09888.HK), MEITUAN-W (03690.HK), BABA-W (09988.HK) and JD-SW (09618.HK) fell by less than 1%. KUAISHOU-W (01024.HK) closed down 0.5% at HKD29.66, hitting another record closing low.

This year's Policy Address contained limited new housing measures, lifting property stocks. NEW WORLD DEV (00017.HK) mounted 2.08%, SINO LAND (00083.HK) gained 1.22%, while HENDERSON LAND (00012.HK) and SHK PPT (00016.HK) each rose by less than 1%.

Apple Inc. (AAPL.US) reportedly accepted sharp memory chip price hikes from Samsung for 1Q27, driving Hong Kong-listed chip stocks higher. HUA HONG GRACE (01347.HK) surged 5.87%, SMIC (00981.HK) rallied 4.77%, BIREN TECH (06082.HK) shot up 2.56%, ILUVATAR COREX (09903.HK) climbed 6.23%, and MONTAGE TECH (06809.HK) advanced 5.46%.

Apple supply chain stocks were in a good shape, with LUXSHARE ICT (02475.HK) up 4.1%, LENS (06613.HK) up 2.4%, and BYD ELECTRONIC (00285.HK) up 3.1%.

For other blue chips, LENOVO GROUP (00992.HK) jumped up 8.33%, making it the best-performing blue chip of the day, after its CFO said net profit margin could reach Dell's level. CATL (03750.HK) sagged nearly 3% again to close at HKD501, a six-month low, barely holding above the HKD500 mark. Daiwa reportedly said CATL may cut production in September and that unit net profit in 3Q could decline QoQ. HSBC HOLDINGS (00005.HK), which dropped over 3% yesterday, rebounded 0.81% to reclaim the HKD160 level.
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BEIJING, Sept. 16, 2026 /PRNewswire/ -- Zoomlion Heavy Industry Science & Technology Co., Ltd. ("Zoomlion") recently fielded its independently developed humanoid robots at the second World Humanoid Robot Games in Beijing, where they competed in the standing high jump, 100-meter sprint and standing long jump. The events provided demanding conditions for evaluating gait algorithms, joint responsiveness and overall stability under high-speed motion and complex control conditions, while providing data to further refine the company's full-stack capabilities across algorithms, software, hardware and industrial applications.

Zoomlion's robots delivered consistent performances across all three events, showcasing the integration of their hardware architecture, AI algorithms and motion-control systems. Their showing reinforced the company's position among the field's leading robotics developers.

Zeng Guang, general manager of Zoomlion's ZValley, said the events measured more than speed and strength, providing a broader assessment of the company's AI capabilities and its ability to deploy robots in real-world settings. Competing alongside teams from around the world also allowed Zoomlion to benchmark its technology and refine its systems and products for greater reliability and adaptability in industrial settings.

The company has deployed dozens of its humanoid robots across its smart factories, where they perform material sorting, cable-harness tying, component preassembly, precision assembly, finished-product inspection and factory patrols.

The bipedal Z01 uses AI-powered imitation learning to organize randomly placed objects and precisely arrange and tie cable harnesses. The wheeled Z03 can independently handle precision processes, including preassembling mirrors for industrial equipment, to meet the accuracy requirements of production lines.

Zoomlion draws on real-world operating data from these deployments, as well as more than 300 intelligent production lines and over 2,000 industrial robots running year-round. This data supports the continued refinement of AI models, algorithms and robot performance, creating a cycle in which technology enables deployment and real-world experience informs further development.

Zoomlion's portfolio includes bipedal and wheeled humanoid robots as well as quadruped robots, backed by in-house capabilities spanning core components, operating systems, complete robot systems and industrial applications. The company is among the few AI-native robotics companies to combine full-stack humanoid robot development, deployment at scale and continuous improvement based on real-world data. It is also the only high-end equipment manufacturer to have developed and deployed embodied AI robots.

Zoomlion will continue advancing its embodied AI technologies and scaling humanoid robot deployments across industrial manufacturing, specialized operations and smart services.

South Korean Deputy Prime Minister and Minister of Science and ICT, Bae Kyung-hoon, said South Korea must continue to push forward with AI development without delay, adding that the country can no longer afford the cost of slowing AI development.

In his view, there is a fundamental difference among countries that are already in a leading position and choose to slow development, and countries that are still catching up while also trying to open up markets.

Today (16th), XL2CSOPHYNIX (07709.HK) and XL2CSOPSMSN (07747.HK) advanced 5.82% and 3.12%, respectively.
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德國漢諾威2026年9月15日  /美通社/ -- 寧德時代新能源科技股份有限公司(CATL) 於9月14日在2026年IAA漢諾威國際商用車展上，推出新一代商用車電池解決方案TECTRANS II（天行II）。

寧德時代海外業務部總裁李小寧表示：「商用車電動化正成為全球能源轉型的第三波浪潮。寧德時代將圍繞產品、能源、服務與生態，攜手全球合作伙伴緊抓這一機遇。」

TECTRANS II：面向商用車電動化打造的模塊化平台

場景適配能力：適配多元商用車應用與運營需求

• 平台適配多場景：通過配置不同數量的標准化電池包，TECTRANS II可滿足不同電量與載重需求，車輛最大續航裡程可達1000公裡。
• 靈活技術路線：該平台兼容電驅橋與中央驅動兩種架構，支持充電與換電模式靈活切換。
• 一套硬件配置，全生命周期兼容：平台統一外部尺寸、電氣接口與通信協議，電池技術與電池包設計可迭代升級。新款及現有車型均可受益於後續技術升級，無需對整車平台進行大規模改動。
• 模塊化設計可幫助整車廠將車輛開發周期縮短50%，研發成本降低60%至70%，助力車型更快落地，降低適配成本。

全生命周期經濟性：提升車輛全生命周期收益

• 更快回本周期：模塊化平台無需為每一款車型單獨開發專用電池系統，幫助整車廠壓縮開發成本、縮短上市周期，降低前期投入風險。
• 更高運營收益：TECTRANS II從三方面提升車隊經濟效益。
  • 更高能量密度：電池質量能量密度達170 Wh/kg，較行業平均水平高出約13%。在電池容量不變的前提下，車輛可額外承載約0.6噸有效載荷。
  • 更長續航、更快補能：頂配版本續航可達1000公裡，搭載兆瓦級快充，25分鍾即可充至80%電量，減少長途干線運輸的充電等待時間。
  • 更高能效：全球首創全極耳低阻抗設計，系統往返效率(RTE)可達96%，降低充電損耗，為日常運營提供更多可用電能。
• 更高保值率：用於重卡的TECTRANS II電池設計壽命12年、行駛裡程150萬公裡，容量保持率可達70%，有效提升車隊資產的保值率。

安全與可靠性：滿足真實商用車運營的嚴苛要求。

• 堅固物理防護：
• 熱成型鋼上蓋：可承受180公斤成年人反復踩踏10000次而不變形。
• 超高強度底板：抗沖擊強度達1,000 J，可保護電池包免受路面沖擊損傷。
• 高強度殼體防護：采用帶抗擠壓筋的擠壓鋁殼體，側向抗擠壓力可達250 kN。
• 15年防腐性能：可在沿海及寒冷地區長期運營。
• 易維護設計：主連接器插拔狀態下均可維持IPXXB防護等級，提升維護過程中的高壓安全性。

• 系統冗余設計：
• 架構冗余：采用多支路獨立電池管理系統(BMS)控制，系統可隔離故障支路，其余支路持續供電。
• 精准故障診斷：自研絕緣故障定位技術，可區分絕緣故障源於電池還是車輛的其他部件，加快故障排查。
• 網絡安全防護：從芯片硬件、軟件程序到整車系統構建多層防護體系，研發全程遵循國際信息安全標准。

TECTRANS II彰顯了寧德時代持續創新、穩定保障產品品質的長期承諾。該平台經過實車扭轉、外部火燒等嚴苛測試與真實場景運營驗證，能夠在嚴苛的商用車運營場景下保障安全性、可靠性與長久使用壽命。

攜手共建歐洲綠色貨運走廊

展會期間，寧德時代還與DHL集團簽署諒解備忘錄。雙方在2024年9月合作協議的基礎上，將在歐洲打造多條綠色貨運走廊。合作方將依托DHL的物流網絡、運營經驗與實際運輸需求，結合寧德時代的電池技術與電動化生態體系，聯合整車廠及其他合作伙伴，共同開發專用電動車輛並開展試點落地。

寧德時代海外業務部首席技術官朱凌波表示：「商用車電動化進程將持續十余年。憑借深厚的技術積累與長期投入，寧德時代願成為全球客戶最可靠的合作伙伴，助力全球貨運交通電動化。」

Huawei Supervisory Board Chairman Guo Ping recently said that, regarding its large model strategy, Huawei is focused on connectivity and computing fields, while different business segments have varying demands for self-developed large models. Huawei's large model strategy is closely integrated with its own business objectives, maintaining investment while adopting differentiated deployment based on business scenarios.

Regarding the ICT business and computing field, Guo said Huawei's goal is to become NVIDIA Corporation (NVDA.US). The company's core advantage does not lie in possessing self-developed large models, but in supporting customers in building outstanding large models and ensuring that any large model globally can operate efficiently on Huawei Ascend, Kunpeng, supernodes and clusters.
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HONG KONG, Sept. 16, 2026 /PRNewswire/ -- Foxconn Interconnect Technology (FIT Hon Teng, HKEX: 6088) today hosted FIT Tech Day 2026, themed "Light at Scale: The Next Frontier in Data Center Interconnects." The event brought together global leaders from the optical communications, AI, and semiconductor industries to explore the next generation of connectivity for AI, spanning light sources, materials, photonics, network architectures, manufacturing, and the broader industry ecosystem.

The event also showcased the cross-disciplinary integration capabilities of the Hon Hai Technology Group. Young Liu, Chairman of Hon Hai Technology Group, attended the event, while Brand Cheng, Chairman of FII, delivered the opening remarks. Together, they highlighted the Group's comprehensive capabilities spanning semiconductors, AI, cloud infrastructure, and advanced manufacturing.

"AI is redefining data center architectures while simultaneously driving optical communications into a new phase of development. Over the next decade, we expect to see not only faster optical technologies, but also how optical connectivity can be deployed more reliably and efficiently at scale," said Sidney Lu, Chairman of FIT. "By integrating the diverse businesses and technological capabilities across the Hon Hai Technology Group, we have an opportunity to advance innovation in optical communications beyond individual components toward more integrated systems and large-scale applications."

The first half of the event featured four keynote sessions exploring the next steps for optical communications in the AI era from different layers of the technology stack. Dr. Wupen Yuen of Lumentum examined the interconnect requirements driven by Scale-up, Scale-out, and Scale-across in AI system architectures, as well as the trend toward optics becoming a core element of AI system architecture. Dr. Chuck Mattera reviewed the evolution of semiconductors, lasers, fiber optics, computing, and manufacturing, and looked ahead to the evolution from Pluggable Optics, CPO, and Optical I/O to Photonic Fabrics, supporting the transition of optical technologies toward large-scale deployment. Mr. Yoshiaki Sato of NTT Innovative Devices focused on the evolution of photonics-electronics convergence from an industry vision toward practical implementation, and shared the detachable Optical Engine architecture based on socket technology co-developed with FIT. Mr. Ashkan Seyedi of ams OSRAM introduced Wide & Slow Optics and Micro Emitter technologies, exploring how optics moving closer to the compute core can address low latency, efficiency, density, reliability, and manufacturability.

The second half of the event featured a panel discussion moderated by Dr. Thomas Liu of FIT, bringing together Dr. Hong Hou, CEO of Semtech; Dr. WP Huang, Chairman of Ligent; Mr. Ernest Muhigana of MACOM; and Dr. Hao-Chung Kuo, Head of the Semiconductor Research Center at Hon Hai Research Institute. The panel explored optical modules, CPO, high-speed interconnects, and the broader ecosystem required by AI infrastructure, discussing how innovations in optical communications can advance toward reliable and scalable large-scale deployment as AI infrastructure continues to expand.

FIT Tech Day 2026 brings together leaders across the optical communications, AI, semiconductor, and data center industries for in-depth cross-industry exchange. Through "Light at Scale," FIT and its global industry partners are exploring the technologies, architectures, and collaborations shaping the next generation of connectivity.

About Foxconn Interconnect Technology (FIT Hon Teng)

Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company's website at www.fit-foxconn.com

香港2026年9月16日 /美通社/ -- 鴻海旗下鴻騰精密科技（FIT Hon Teng, 6088.HK）「FIT Tech Day 2026」今日熱鬧展開，這次以 「Light at Scale: The Next Frontier in Data Center Interconnects」為主題，匯聚全球光通訊、AI 與半導體產業領袖，從光源、材料、光子技術、網路架構到製造與產業生態，共同探索 AI 下一世代的 Connectivity。

本次活動也展現鴻海集團跨領域的整合力量，由鴻海科技集團劉揚偉董事長親自出席，同時由工業富聯鄭弘孟董事長擔任開場嘉賓，以集團與產業的高度揭開活動序幕，展現鴻海集團半導體、AI、雲端基礎建設到製造能力的完整布局。

「AI 正在重新定義資料中心的運算架構，也同步推動光通訊進入新的發展階段。未來十年，我們看到的將不只是更高速的光，而是光如何以更可靠、更具效率的方式走向大規模部署。」FIT 盧松青董事長表示「鴻海集團透過集團不同事業與技術能力的整合，我們有機會將光通訊的創新從單一元件推向更完整的系統與大規模應用。」

活動上半場由四場專題演講開始，以不同技術層次深入探討 AI 時代光通訊的下一步。Lumentum Dr. Wupen Yuen 袁務本博士 探討AI 系統架構Scale-up、Scale-out 與 Scale-across 對互連的需求，以及光學技術邁向AI 系統架構核心的趨勢；Dr. Chuck Mattera 則是回顧半導體、雷射、光纖、運算與製造技術的演進，並展望 Pluggable Optics、CPO、Optical I/O 一路演進至Photonic Fabrics 的光產品規模化，推動光通訊技術走向大規模應用；NTT Innovative Devices Mr. Yoshiaki Sato （佐藤良明）將聚焦光電融合產業願景搭配實際應用落地的實績，並現場分享與 FIT 共同開發、以 Socket為基礎的可拆式 光引擎Optical Engine 架構；ams OSRAM Mr. Ashkan Seyedi 則將介紹 Wide & Slow Optics 與 Micro Emitter 技術，探討光學更靠近運算核心後，如何兼顧低延遲、效率、密度、可靠度與量產性。

活動下半場則由 FIT 劉一誠博士主持專題討論，邀集 Semtech CEO 侯宏博士、Ligent 創辦人黃衛平博士、MACOM Mr. Ernest Muhigana，以及鴻海研究院半導體研究中心郭浩中所長，從光模組、CPO、高速互連一路談到 AI 基礎建設所需的產業生態系，進一步探討在 AI 持續擴張下，光通訊技術創新未來邁向可靠、可擴展的大規模部署。

FIT Tech Day 2026 將帶來一場跨越產業鏈的深度交流。誠摯邀請全球光通訊、AI、半導體及資料中心產業夥伴蒞臨 FIT Tech Day 2026，與來自全球的產業領袖面對面交流，一起探索 Light at Scale 所開啟的下一個世代。

關於鴻騰精密科技（FIT Hon Teng）

鴻騰精密科技 （香港交易所代碼：6088） 2017年於香港掛牌上市，為大中華區第一大消費性電子產品連接器廠商。以製造連接器產品為主要核心，近年策略發展 5G AIoT、電動車及聲學電子元件產品，並跨足經營消費者品牌。更多訊息，請洽公司網站www.fit-foxconn.com。

Meta Platforms, Inc. (META.US) CEO Mark Zuckerberg commented on AI safety on Tuesday (15th), with a stance closer to NVIDIA Corporation (NVDA.US) CEO Jensen Huang than Anthropic CEO Dario Amodei.

Zuckerberg posted on X and other social media platforms that he believed AI labs not focused on "alignment" will fall behind. Alignment refers to efforts by developers to ensure technology aligns with human values.

AI safety has recently drawn heightened attention after Amodei published an article over the weekend calling on the technology industry to slow the pace of improving AI model capabilities. OpenAI CEO Sam Altman later voiced support, while US President Donald Trump criticized the proposal.

Zuckerberg said that there is currently a lot of debate about slowing capability progress until alignment catches up. He believed trust and alignment are rapidly becoming the most important capabilities distinguishing agents and models.

Zuckerberg said AI labs face significant liability if their models cause harm, giving companies incentives to prevent potential issues, reflecting a more market-oriented view that was consistent with comments made publicly by Jensen Huang on the same day.

Zuckerberg added that Meta had previously delayed the launch of its Muse AI technology for safety and security reasons.
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Anthropic CEO Dario Amodei and NVIDIA Corporation (NVDA.US) CEO Jensen Huang expressed differing views on AI safety issues at the Salesforce Dreamforce conference, with the debate becoming a market focus in recent days.

Amodei first appeared on stage with Salesforce, Inc. (CRM.US) CEO Marc Benioff. Earlier, Amodei published an article over the weekend calling on the industry to slow the pace of model development.

OpenAI CEO Sam Altman, Space Exploration Technologies Corp. (SPCX.US) CEO Elon Musk and Google DeepMind Chairman Demis Hassabis later voiced support for Amodei's proposal.

Jensen Huang, who later shared the stage with Benioff, took a different view. He said market forces already exist and the industry does not need additional laws or regulatory measures. He added that speed and safety are not mutually exclusive, but companies should control the pace before ensuring products launched to the market are acceptable and safe.

Huang commented that this is a false binary choice, and people can absolutely achieve both at the same time, noting that model developers have a responsibility to handle products responsibly.

Huang suggested to move as fast as possible, but if at any time the company is perceived to be out of control, or the product cannot ensure safety, then it should be paused and things should be done correctly.
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An OpenAI spokesperson confirmed to CNBC on Tuesday (15th) that the company has been engaging with other AI companies, including Anthropic and Google, on how to cooperate in addressing safety issues.

The spokesperson said the discussions have continued since Google DeepMind Chairman Demis Hassabis proposed in July the establishment of a US-led "standards body".

Hassabis wrote on X at the time that he proposed creating a public-private partnership or self-regulatory organization overseen by the federal government, similar to the Financial Industry Regulatory Authority (FINRA).

Although OpenAI, Anthropic and Google are fierce competitors, all three companies have recently faced mounting pressure to address increasing AI safety and security concerns.

Anthropic CEO Dario Amodei called on AI companies last Saturday (12th) to slow the pace of advancing the industry's most cutting-edge models, drawing praise from Hassabis and OpenAI CEO Sam Altman.
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