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2026-04-21
17:30
Newborn Town Launches NUSD Pay to Advance AI Agent Pay and Improve Cross-Border Payment Efficiency

HONG KONG, April 21, 2026 /PRNewswire/ -- Newborn Town, a leading global social entertainment company, announced the launch of its AI Agent Pay project, NUSD Pay, marking its strategic move into autonomous payment infrastructure for AI Agents.

As a global technology company with deep roots in overseas markets, Newborn Town's products and services cover multiple regions, including MENA, Southeast Asia, Latin America, and Europe, supported by a broad and diversified global user base. Across its global operations, the efficiency of cross-border fund flows and settlement has always been a critical infrastructure capability.


In the second half of 2025, Newborn Town officially initiated the NUSD Pay project. The core system has now been completed and entered commercial operation. Compared with traditional cross-border payment solutions, NUSD Pay is able to reduce overall transaction costs by more than 70%, delivering a more efficient, secure, and seamless payment and settlement experience for global merchants.

From current industry practices, the application of AI Agent Pay is rapidly expanding across multiple scenarios, including API usage billing, data and content access, and computing resource allocation, and is expected to gradually evolve into the next generation of digital payment infrastructure.

NUSD Pay is currently developing its AI Agent payment product based on the x402 protocol. The x402 protocol moves payment capabilities from the traditional application layer down to the HTTP protocol layer. Its core mechanism leverages the HTTP 402 Payment Required status code to trigger payment flows, creating a standardized framework for machine-to-machine transactions.

Through this protocol, when AI Agents call services or execute tasks, they can automatically complete payment settlement just like making an API request—without requiring manual authorization for each transaction—enabling seamless autonomous transactions between machines.

At present, NUSD Pay has completed the initial deployment of AI Skills on the OpenClaw platform, allowing users to access product information and API development documentation for NUSD Pay through natural language interaction.

According to the project lead, the company plans to gradually expand these capabilities in the future, including data inquiries, automated reconciliation, wallet address creation, and backend management functions, further lowering the barriers for enterprise clients to integrate payment systems.

NUSD Pay will first serve Newborn Town's own global business ecosystem, while also launching enterprise-level payment solutions for B-end clients. Regarding the rationale behind entering the AI Agent Pay business, the person in charge stated that the move is primarily driven by the long-term development needs of the company's global operations.

"The launch of NUSD Pay represents a long-term strategic exploration by the company amid the evolution of global payment technologies. As AI technology continues to advance, an increasing number of commercial activities may eventually be completed autonomously by AI systems. The business is still at an early stage, and we will continue to closely monitor the development of AI Agent payment trends, while actively exploring related technologies and application scenarios within a compliant framework."

 

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15:55
RoboSense Unveiled EOCENE SPAD-SoC Architecture and Chipsets Phoenix and Peacock: Ushering the LiDAR Industry into the Image-grade Era of High-Definition 3D Perception

  • RoboSense debuted the EOCENE SPAD-SoC architecture, enabling rapid incubation of a diverse chipset portfolio while streamlining R&D workflows to deliver significant structural cost advantages.
  • RoboSense launched the Phoenix chipset, the industry's first automotive-grade monolithic SPAD-SoC, delivering 2,160-beam image-grade output to establish a new benchmark for high-definition 3D perception.
  • RoboSense introduced the Peacock chipset, a fully solid-state, ultra-large array SPAD-SoC, propelling robotics into the era of image-grade 3D perception
  • RoboSense's RGBD sensor is slated for official release by the end of 2027

SHENZHEN, China, April 21, 2026 /PRNewswire/ -- RoboSense (HKEX: 2498), an AI-driven robotics technology company, hosted its 2026 Tech Day in Shenzhen today, marking a landmark moment with the global debut of its pioneering self-developed SPAD-SoC architecture, EOCENE, and two flagship image-grade chipsets, Phoenix and Peacock. Alongside these core launches, RoboSense offered a strategic preview of its revolutionary RGBD sensor, slated for release in 2027. This breakthrough signifies a paradigm shift in 3D perception technology, solidifying RoboSense's position as the architect of the industry's next technological cycle, and an insightful visionary poised to capture the expansive market potential now unfolding.

Mark Qiu, CEO of RoboSense, remarked: "Drawing a strategic parallel to the historic transition from CCD to CMOS within the imaging industry, we believe the LiDAR sector has reached a critical inflection point. By establishing our proprietary SPAD-SoC architecture as the foundation, we are redefining the metrics of 3D perception. In our view, mastery of chipset capability is the ultimate arbiter of generational advantage. Those who command the silicon effectively wield control over product generational evolution, securing a privileged position and holding the high ground in the future industry landscape."

RoboSense's overarching strategy centers on the vertical integration of proprietary chipset R&D and advanced module engineering. Securing a dominant position in the coming stage of large-scale commercialization requires a full-stack approach: proprietary chipset capabilities establish technological generational leads and structural cost advantages, while module engineering ensures system-level excellence in point-cloud fidelity, ranging precision, and interference rejection. By integrating these twin engines, RoboSense is establishing the definitive performance benchmarks for the next phase of industrial evolution of 3D perception.

The Visionary Trend of LiDAR Industry Evolution

The shift from analog to digital architectures is an industry imperative. Mirroring the historic pivot from CCD to CMOS in the imaging sector, RoboSense recognizes that the LiDAR industry has reached its definitive "CMOS moment." Legacy analog architectures have hit inherent performance ceilings, where further scaling triggers prohibitive complexity and linear cost escalation. In the LiDAR sector, analog solutions—epitomized by SiPM—are destined to be superseded by SPAD architectures, much like the transition that once rendered CCD obsolete. Furthermore, sharing the same semiconductor lineage as CMOS, SPAD technology capitalizes on Moore's Law, enabling direct access to the mature process nodes and infrastructure of the global semiconductor ecosystem.

The evolution toward high-beam, image-grade performance is equally irreversible. Under the SPAD architecture, the performance ceiling of LiDAR has been significantly elevated, dramatically enhancing detection capabilities for small objects at long ranges and ensuring robustness in adverse weather. By reaching 2160 beams, LiDAR enters the 4-megapixel era; as it scales further to 4000 beams, it achieves an 8-megapixel output, meeting the true 4K standard. This transition into the image-grade era will fundamentally redefine safety standards—positioning high-resolution LiDAR as a non-negotiable safeguard for both L2+ and L3 autonomous vehicles.

EOCENEThe SPAD-SoC Platform

RoboSense introduced its groundbreaking SPAD-SoC architecture, the EOCENE. Named after the dawn of a new era, the platform marks a fundamental transition from discrete technical breakthroughs to a scalable production model. By codifying nine years of full-stack experience into a standardized R&D paradigm, EOCENE enables the rapid incubation of a high-performance SoC portfolio, establishing a systematic competitive barrier through efficient innovation.

The EOCENE SPAD-SoC architecture is designed with 4 Core Functional Layers:

  • Fundamental Process Layer: Unified 28nm advanced process node with automotive-grade design; features 3rd-Gen ultra-sensitivity SPAD with a world-leading 45% PDE and 2nd-Gen 3D-stacking via wafer-level hybrid bonding.
  • Core Computational Layer: Configurable 4320-Core heterogeneous compute Array; powered by a high-bandwidth network-on-chip (NoC) supporting 495 billion point-cloud samplings/s and an up to thousand-beam ultra-HD perception enhancement engine.
  • Algorithm Acceleration Layer: hardware-integrated anti-Interference & signal processing engine; delivers up to 99.9% sunlight noise suppression and 99.9% crosstalk immunity with smart pixel management for optimized perception.
  • Security & Reliability Layer: Automotive-grade secure silicon architecture; strictly engineered for extreme reliability and operational resilience across a temperature range of -40°C to 125°C.

The Phoenix Chipsets

RoboSense unveiled Phoenix, an automotive-grade monolithic SPAD-SoC capable of 2,160-beam image-grade output. The Phoenix series will feature a versatile lineup of five distinct models, specifically engineered to support LiDAR designs spanning 2160, 1440, 720, 480, and 240 beams. Compared to designs that cluster or cascade multiple chips to achieve high beam counts, Phoenix delivers true 2160-beam performance independently through a streamlined, single-optical path. This state-of-the-art monolithic integration enables an ultra-high resolution of 2160 × 1900—surpassing the point-cloud fidelity of a 4MP camera—and outputs 2K ultra-HD near-infrared (NIR) imagery. With a 600-meter detection range and AEC-Q100 certification, Phoenix evolves LiDAR from a basic ranging sensor into a sophisticated visual imaging system. The 2,160-beam solution based on Phoenix have already secured design wins from world-leading automakers, with mass production scheduled in 2026. 

The Peacock Chipset

RoboSense unveiled Peacock, a premier all-solid-state ultra-large array SPAD-SoC featuring a high-density resolution of 640 × 480, propelling robotics into the era of image-grade 3D perception. By integrating this massive matrix into a single SoC, Peacock shifts LiDAR output from sparse data points to VGA-level imaging output. The chipset provides an expansive 180° × 135° field of view (FOV) and millimeter-level precision, capable of detecting objects as close as 5cm. Designed for broad cross-industry adoption, Peacock's versatile architecture seamlessly adapts to diverse applications—from automotive blind-spot detection and low-speed autonomous vehicles to industrial safety, robotics, and emerging super-sensor form factors. Peacock is slated for mass production in Q3 2026, with initial batch deliveries already underway to key customers.

RGBD: Advancing Spatial Intelligence with Color-Enriched 3D Imaging

By integrating a color filter array with the high-resolution output of the Peacock chipset, RoboSense has achieved advanced RGBD (Red, Green, Blue + Depth) 3D vision. The core of this innovation is Peacock's ability to output high-density spatial data, which allows the seamless integration of color information directly onto 3D point clouds.

RoboSense has long been a pioneer in the exploration of sensor fusion. The introduction of the AC1 and AC2 Active Camera series in 2025 provided the industry with a diverse range of integrated perception solutions, laying the essential groundwork for advancing colorized 3D vision. RoboSense's new RGBD sensor is slated for official release by the end of 2027.

Looking ahead, RoboSense is committed to ushering in an era where 3D perception achieves the same ubiquity as the modern camera. By integrating its visionary technology into every vehicle, every robot, and every physical AI terminal, RoboSense is not merely participating in a technological shift—it is standing as the definitive architect of a new epoch in 3D perception.

Please access the full press kit via the link:
https://www.dropbox.com/scl/fo/zafeavobmdke8cp0mgmtt/AKduk648136gxk3w9moF87o?rlkey=5n0n2843o5hpvqgm0fxmi2q9t&st=nagfu804&dl=0

About RoboSense

RoboSense (02498 HKEX) is an AI-driven robotics company, founded in 2014 and headquartered in Shenzhen, China. Leveraging its full-stack, in-house developed digital chips and a robust AI technology system, the company provides core robotic components, perception systems, and manipulation solutions across a wide range of industries, including autonomous passenger and commercial vehicles, Robotaxi, as well as robotics applications in autonomous logistics, robotic lawn mowers, and humanoid robots.

As a global leader in the LiDAR industry, RoboSense has partnered with over 310 automotive brands and Tier-1 suppliers. In the robotics sector, it is the preferred solution provider for autonomous logistics, robotic lawn mowers, humanoid robots, and other pan-robotics applications, serving more than 3,400 clients worldwide. In 2025, the company ranked first in LiDAR market share in the robotics sector.

Building on its globally leading perception capabilities, RoboSense has extended its technology into robotic manipulation, launching robotic vision systems, dexterous hands, and hand-eye coordination solutions, driving the large-scale commercialization in the era of Physical AI.


 

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14:42
BABA-W-backed AI Video Startup PixVerse Said to Plan HK IPO as Early as This Yr

PixVerse, an AI video startup backed by BABA-W (09988.HK), is considering an IPO in Hong Kong as early as this year, Bloomberg quoted sources as saying.

It is reported that PixVerse is working with banks including CICC and JPMorgan to prepare for the listing. However, details like the final timing and valuation may change.

PixVerse raised US$300 million in a Series C financing round this year, with a valuation exceeding US$1 billion. The company is one of several startups developing AI video systems for advertising, entertainment and social media. Its competitors include OpenAI, ByteDance's Seedance and Alphabet (GOOGL.US).
~

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Website: www.aastocks.com

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14:17
耐世特EMB臻熟亮相北京車展,全棧式運動控制再拓新局

北京2026年4月21日 /美通社/ -- 全球領先的運動控制技術公司耐世特汽車系統(HK 1316)宣佈,其電子機械制動(EMB)產品已完成全系列開發與嚴苛驗證,正式面向市場。這是繼2025年上海車展首次亮相後,耐世特在EMB領域取得的重要里程碑,標誌著產品已全面成熟可量產,公司已具備從線控轉向到線控制動的全棧式線控運動控制技術能力。

從藍圖到征途:寒暑淬煉,不負期待
自2025年上海車展首次發佈以來,耐世特EMB產品在短短一年內取得了長足進展。耐世特同步推進了產品設計、產線建設與供應鏈佈局,實現了全鏈條協同開發。截至目前,耐世特EMB已完成仿真測試、台架測試及冬季極寒工況下的全部嚴苛驗證。公司與國內多家主流整車廠開展了深度需求交流,20餘家客戶在深度駕駛評測後給予了充分肯定與高度評價,已有多個項目進入技術合作開發。

進入2026年,中國汽車產業正經歷從功能堆疊到場景驅動的關鍵轉變。主機廠不再追逐冗長的功能清單,而是尋求能切實解決用戶痛點、提升駕駛體驗的集成方案。耐世特依托在轉向與制動領域的技術積澱,已率先在城市通勤、窄位泊車等高頻場景中展開融合功能的創新探索。

從轉向到制動:全棧式運動控制能力的自然延伸
作為運動控制領域的專家,耐世特將其在轉向系統領域積累的深厚工程能力延伸至制動領域,構建起覆蓋轉向與制動的全棧式運動控制能力。這一跨越並非從零開始,而是基於耐世特在多維度的協同優勢:

  • 全棧式底盤控制軟件,開放接口:從單一功能堆疊走向深度協同融合,搭載獨有的「制動轉向融合」軟件,實現跨域功能安全冗余,為L3及以上高階自動駕駛提供可靠的執行層保障。基於現有成熟的轉向技術模塊實現快速開發落地,並提供開放接口,使整車廠能迅速將其納入自身軟件定義汽車架構中。
  • 硬件復用,降本增效:執行器模塊(電機、減速機構、傳感器)與運動控制器硬件(ASIL-D級MCU、預驅芯片、電源芯片)實現平台化復用,顯著縮短開發週期、降低系統成本。
  • 製造協同,優勢佈局:裝配設備可實現復用,相似工藝難點進行並行開發。耐世特一如既往地以全球統一的高質量標準,依托覆蓋全球的製造佈局,為EMB產品的穩定交付提供堅實保障。
  • 供應鏈整合,成熟穩定:核心供應商高度重合,集中採購發揮規模效應,成熟的全球價值鏈為產品量產提供了穩定的供應保障。

「耐世特線控轉向與EMB的融合併非簡單的『1+1』,而是基於機電一體化底層邏輯的必然進化,是實現高階自動駕駛安全性與經濟性的關鍵路徑。」耐世特汽車系統高級副總裁、首席戰略官、亞太區總裁李軍表示,「選擇耐世特,不僅是選擇線控轉向與EMB兩個部件,更是選擇了一套經過驗證、可量產、成本可控的完整底盤運動控制解決方案。」

運動,精準,信賴。 ——耐世特以百年工程積澱,為整車客戶和終端消費者提供安全、可靠、值得信賴的運動控制體驗。

2026北京車展期間,誠邀您蒞臨北京中國國際展覽中心(順義館)W1館W1B03耐世特展台,親身體驗EMB等前沿技術帶來的突破性創新成果。

關於耐世特汽車系統
耐世特汽車系統(HK 1316)作為一家領先的運動控制技術公司,加速實現安全、綠色和振奮人心的移動出行。我們創新的產品和技術組合為底盤的「線控運動控制」 (Motion-by-Wire™)提供助力,包括電動助力和液壓助力轉向系統、線控轉向和後輪轉向系統、轉向管柱與中間軸、驅動系統、軟件解決方案以及線控制動,為包括電氣化、軟件/網聯、先進駕駛輔助系統(ADAS)/自動駕駛和共享出行在內的所有大趨勢所面臨的運動控制挑戰提供解決方案,為全球60餘家客戶提供服務,包括寶馬、福特、通用、雷諾日產三菱、斯泰蘭蒂斯、豐田、大眾,以及中國的比亞迪、小米、長安、理想、奇瑞、長城、吉利、小鵬等和印度的汽車製造商。www.nexteer.com

訪問耐世特媒體庫

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13:13
Nexteer Introduces Market-Ready EMB at Auto China 2026, Advancing Comprehensive Motion Control Solutions

BEIJING, April 21, 2026 /PRNewswire/ -- Nexteer Automotive (HK 1316) announces that its Electro-Mechanical Brake (EMB) is now ready for market after completing development and validation. After debuting at Auto Shanghai 2025, EMB has reached maturity for mass production. With this, Nexteer now offers full Motion-by-Wire™ capabilities, including Steer-by-Wire and Brake-by-Wire.

From Blueprint to Journey: Tested in Extreme Conditions, Fulfilling Expectations 
Nexteer's EMB product has seen remarkable advancements since its launch at Auto Shanghai 2025. In one year, Nexteer has moved forward with product design, production line development, and supply chain integration, fostering seamless collaboration across all stages. The EMB has successfully passed rigorous simulations, bench tests, and extreme winter testing. The company has held thorough discussions with key local OEMs regarding technical requirements. After conducting comprehensive test drives, more than 20 customers offered high praise for the product. Several projects are now progressing into technical co-development.

Entering 2026, China's automotive industry is undergoing a major shift — moving from simply stacking features to solving real‑world driving scenarios. OEMs no longer chase long checklists of technology; they want integrated solutions that address actual user pain points and deliver a better driving experience. Building on its deep expertise in both steering and braking, Nexteer is already taking the lead in developing integrated functions for high‑frequency scenarios like city commuting and tight‑space parking.

From Steering to Braking: Advancing Comprehensive Motion Control Capabilities
As an expert in motion control, Nexteer leverages its extensive engineering proficiency in motion control by expanding from steering systems into the braking sector, thereby establishing robust full-stack motion control solutions encompassing both steering and braking functions. This development is founded upon Nexteer's existing competencies across numerous areas, rather than beginning anew.

  • Full-stack chassis control software with open interfaces – Evolving from traditional feature superposing to deep, integrated collaboration. Equipped with Nexteer's proprietary "braking-steering fusion" software, it enables cross-domain functional safety redundancy and provides a reliable actuation layer for L3 and higher level of autonomous driving. Built on proven, mature steering technology modules and designed with accessible interfaces, it allows OEMs to rapidly integrate the solution with their own software-defined vehicle architectures.
  • Hardware reuse for cost and efficiency – Actuator modules (motors, reduction mechanisms, sensors) and motion controller electronics (ASIL-D MCUs, pre-driver chips, power management chips) are platformized for reusing, significantly shortening development duration and reducing system costs.
  • Manufacturing synergy with strategic global footprint – Assembly equipment can be reused, and similar process challenges are tackled through parallel development. Staying true to its consistently high global quality standards, Nexteer leverages its worldwide manufacturing footprint to provide solid support for the reliable delivery of EMB products.
  • Mature supply chain integration – High supplier overlap drives centralized procurement and economies of scale. Nexteer's proven global value chain ensures a stable, reliable supply for mass production.

"The integration of Nexteer's Steer-by-Wire and EMB isn't just a simple '1+1' — it's a natural evolution rooted in the fundamentals of mechatronics, and a key enabler for achieving both safety and cost-effectiveness in high-level autonomous driving," said Jun Li, Senior Vice President, Chief Strategy Officer and APAC Division President, Nexteer Automotive. "Choosing Nexteer means more than just picking up two components — it means getting a complete, proven, production-ready, and cost-effective chassis motion control solution."

Motion, Millisecond, Mastery. With a century of engineering heritage, Nexteer delivers safe, reliable, and trustworthy motion control experiences — for OEMs and drivers alike.

Visit Nexteer at Booth W1B03, Hall W1, China International Exhibition Center (Shunyi) during Auto China 2026 to experience the breakthrough innovations of EMB and other cutting-edge technologies firsthand.

ABOUT NEXTEER AUTOMOTIVE
Nexteer Automotive (HK 1316) is a global leading motion control technology company accelerating mobility to be safe, green and exciting. Our innovative portfolio supports Motion-by-Wire™ chassis control, including electric and hydraulic power steering systems, steer-by-wire and rear-wheel steering systems, steering columns and intermediate shafts, driveline systems, software solutions and brake-by-wire. Celebrating 120 years of automotive innovation in 2026, Nexteer builds on a strong legacy of engineering excellence while continuing to shape the future of mobility. The company solves motion control challenges across all megatrends – including electrification, software/connectivity, ADAS/automated driving and shared mobility – for global and domestic OEMs around the world including BMW, Ford, GM, RNM, Stellantis, Toyota and VW, as well as automakers in India and China including BYD, Xiaomi, ChangAn, Li Auto, Chery, Great Wall, Geely, Xpeng and others. www.nexteer.com  

Links to Nexteer Media Center

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11:43
JPM Positive on Apple Hardware Engineering SVP Succeeding as CEO; Rating Overweight

JP Morgan issued a research report stating that Apple (AAPL.US) Senior Vice President of Hardware Engineering John Ternus will succeed Tim Cook as CEO, while Cook will transition to Executive Chairman on September 1 and continue to support the company's communication and engagement with global policymakers.

The broker viewed the announcement positively, noting that companies are endeavoring to develop smartphones and next-generation product form factors amid intensifying market competition, which are expected to become key carriers for the broad application of AI.

Meanwhile, Apple's elevation of a senior executive focused on products and hardware to the CEO position is therefore significant. At the same time, Apple can continue to benefit from Cook's leadership at the global policy level. The broker assigned an Overweight rating to Apple.
~

AASTOCKS Financial News
Website: www.aastocks.com

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10:54
Cadonilimab Combination Demonstrates Promising Survival Benefit in Locally Advanced Pancreatic Cancer: Phase II COMPASSION-26 Data Presented at AACR 2026

HONG KONG, April 21, 2026 /PRNewswire/ -- Akeso, Inc. (9926.HK) ("Akeso" or the "Company") today announced that positive Phase II results from the COMPASSION-26 study evaluating cadonilimab, its first-in-class PD-1/CTLA-4 bispecific antibody, in combination with chemotherapy as first-line treatment for advanced pancreatic ductal adenocarcinoma (PDAC), were presented at the 2026 American Association for Cancer Research (AACR) Annual Meeting.

As of the October 20, 2025 data cutoff, with a median follow-up of more than two years, the cadonilimab plus chemotherapy combination continued to deliver robust and durable survival benefits. Results were particularly strong in patients with locally advanced disease, where the median PFS reached 11.1 months and the median OS exceeded 23 months. Landmark survival rates in this group included a 12-month OS rate of 91.7% and a 24-month OS rate of 44.1%.

The cadonilimab regimen also provided strong tumor control across the overall study population. Of the patients evaluable for efficacy (95% had at least one post-baseline tumor assessment), the objective response rate (ORR) was 33.9% and the disease control rate (DCR) reached 96.4%. Response rates were similar between patients with locally advanced and metastatic disease, indicating consistent benefit across both subgroups.

No new safety signals were identified, and the overall safety profile of the cadonilimab combination remained favorable and manageable.

Cadonilimab is the world's first approved bispecific antibody for cancer immunotherapy, having received marketing approval in 2022. In extensive real-world clinical practice and multiple Phase III studies, it has demonstrated clinically meaningful benefit across all patient populations regardless of PD-L1 expression status, addressing a significant unmet medical need and earning broad recognition from physicians and patients.

As a cornerstone therapy in the era of tumor immunotherapy 2.0, cadonilimab not only offers the significant advantage of clinical benefit across broad patient populations, but has also demonstrated important breakthrough potential in difficult-to-treat settings, including immunotherapy-refractory disease and immunologically "cold" tumors. Akeso is fully leveraging its global leadership in bispecific antibody development for oncology to continue addressing major unmet clinical needs and advancing transformative treatment options for patients with challenging cancers.

About Akeso

Akeso (HKEX: 9926.HK) is a leading biopharmaceutical company committed to the research, development, manufacturing and commercialization of the world's first or best-in-class innovative biological medicines. Founded in 2012, the company has established a robust R&D innovation ecosystem centered on its Tetrabody antibody technology platform, AI-powered drug R&D platform, Dual-Shield ADC technology platform, Dual-Lock T-cell engager (TCE) technology platform, Tissue-Smart siRNA/mRNA technology platform, and cell therapy technology platforms. Supported by a global-standard GMP manufacturing infrastructure and a highly efficient, integrated commercialization model, the company has evolved into a globally competitive biopharmaceutical focused on innovative solutions. With fully integrated multi-functional platform, Akeso is internally working on a robust pipeline of over 50 innovative assets in the fields of cancer, autoimmune disease, inflammation, metabolic disease and other major diseases. Among them, 27 candidates have entered clinical trials (including 15 bispecific/multispecific antibodies and bispecific ADCs. Additionally, 7 new drugs are commercially available. Through efficient and breakthrough R&D innovation, Akeso always integrates superior global resources, develops the first-in-class and best-in-class new drugs, provides affordable therapeutic antibodies for patients worldwide, and continuously creates more commercial and social values to become a global leading biopharmaceutical enterprise.

Forward-Looking Statements
This announcement by Akeso, Inc. (9926.HK, "Akeso") contains "forward-looking statements". These statements reflect the current beliefs and expectations of Akeso's management and are subject to significant risks and uncertainties. These statements are not intended to form the basis of any investment decision or any decision to purchase securities of Akeso. There can be no assurance that the drug candidate(s) indicated in this announcement or Akeso's other pipeline candidates will obtain the required regulatory approvals or achieve commercial success. If underlying assumptions prove inaccurate or risks or uncertainties materialize, actual results may differ materially from those set forth in the forward-looking statements.

Risks and uncertainties include but are not limited to, general industry conditions and competition; general economic factors, including interest rate and currency exchange rate fluctuations; the impact of pharmaceutical industry regulation and health care legislation in P.R.China, the United States and internationally; global trends toward health care cost containment; technological advances, new products and patents attained by competitors; challenges inherent in new product development, including obtaining regulatory approval; Akeso's ability to accurately predict future market conditions; manufacturing difficulties or delays; financial instability of international economies and sovereign risk; dependence on the effectiveness of the Akeso's patents and other protections for innovative products; and the exposure to litigation, including patent litigation, and/or regulatory actions.

Akeso does not undertake any obligation to publicly revise these forward-looking statements to reflect events or circumstances after the date hereof, except as required by law.

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04:35
Apple: John Ternus Appointed as New CEO, Tim Cook to Become Executive Chairman

Apple (AAPL.US) announced on Monday that John Ternus, Senior Vice President of Hardware Engineering, will succeed Tim Cook as Chief Executive Officer (CEO), while Cook will transition to the role of Executive Chairman on September 1.

Cook, who has served as CEO since 2011, will continue in his current capacity until the end of the summer. During this period, he will work closely with Ternus to ensure a smooth leadership transition.
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04:07
Nasdaq Snaps 13-Day Winning Streak as Markets Await US-Iran Ceasefire Deadline; Russell 2000 Hits Record Close Against Trend

The US seized an Iran-flagged cargo vessel over the weekend, heightening geopolitical risks. Meanwhile, the S&P 500 rebounded to a record high last week, and the three major US stock indices edged lower on Monday.

The Nasdaq dipped only 0.3%, or 64 points, to close at 24,404, snapping its 13-day winning streak. The S&P 500 declined 16 points, or 0.2%, to 7,109. The DJIA lost 4 points to 49,442.

However, small-cap stocks outperformed. The Russell 2000 rose 0.6% to 2,792, marking a record closing high, and touched an all-time high intraday.

Software shares advanced, with the iShares Expanded Tech-Software Sector ETF gaining more than 1%. Tesla (TSLA.US) dived nearly 2%, while Intel (INTC.US) dropped 4%.
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AASTOCKS Financial News
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2026-04-20
21:30
Hesai Unveils Picasso 6D Full-Color SPAD-SoC, Next-Gen ETX, and Innovations in Spatial Intelligence and Physical AI

Hesai announces a strategic shift to spatial intelligence, introducing Kosmo, a new spatial intelligence AI hardware platform, alongside robotic actuation modules and innovations for the Physical AI era.

PALO ALTO, Calif., April 20, 2026 /PRNewswire/ -- Hesai Technology (Nasdaq: HSAI; HKEX: 2525), a global leader in intelligent technology and 3D perception, hosted its 2026 Technology Open Day on April 17, showcasing its latest generation of lidar technologies spanning full-color perception, ultra-high-resolution imaging, and spatial intelligence applications.

A key highlight was Picasso, the world's first 6D full-color ultra-sensitive lidar SPAD-SoC, enabling native fusion of spatial and color perception at the ASIC level. Built on this platform, Hesai's ETX lidar series has been upgraded to support up to 4320 channels and is expected to enter mass production in the second half of 2026. The company also previewed Kosmo, a new spatial intelligence AI hardware product, and outlined a new direction in robotic actuation modules for physical AI systems.

Picasso - The World's First 6D Full-Color Ultra-Sensitive Lidar ASIC Platform

At the core of today's announcement is Picasso, Hesai's fifth-generation 6D full-color ultra-sensitive lidar ASIC platform, designed to enable vehicles to see both geometry and color natively on a single chip.

Unlike conventional lidar systems that capture only geometric information such as XYZ, Picasso integrates RGB sensing and time-of-flight (ToF) ranging at the chip-level, enabling the direct generation of colorized point clouds without the need for complex sensor fusion. This 6D full-color capability delivers precise spatial and temporal alignment, resulting in richer environmental understanding and significantly enhancing the perception capabilities of next-generation autonomous systems.

Hesai Picasso - The World’s First 6D Full-Color Ultra-Sensitive Lidar ASIC Platform
Hesai Picasso - The World’s First 6D Full-Color Ultra-Sensitive Lidar ASIC Platform

With photon detection efficiency (PDE) exceeding 40%, Picasso delivers industry-leading sensitivity, enabling stronger long-range performance, better detection of small objects, and improved performance in low-light environments within the same power envelope.

Rather than simply combining camera imagery with lidar point clouds, Picasso enables true ASIC-level fusion, with each point inherently carrying color information. This allows autonomous systems to move from spatial perception to real-time understanding of the driving environment, improving performance in different scenarios such as traffic signals, lane markings, and construction zones.

The introduction of Picasso marks a major step in lidar development, moving beyond incremental improvements in resolution toward a new generation of full-color perception. This breakthrough is supported by Hesai's long-term vertical integration strategy and in-house development across core lidar technologies. Following the launch of Fermi C500, a RISC-V-based high-performance lidar controller SoC that integrates MCU, FPGA functions, and ADC into a single chip, the company has established full-stack in-house ASIC development capabilities. This technology foundation has already translated into large-scale commercialization, with Hesai's upgraded ATX lidar achieving full-scale mass production and securing over 6 million units in orders from leading OEMs.

Today, Hesai is the only lidar company in the world to develop all seven core components in-house, including its laser transmitter, receiver, driver, TIA, ADC, digital signal processor, and controller. To date, 21 of its in-house designs have achieved AEC-Q automotive-grade certification, with cumulative shipments exceeding 230 million units and expected to surpass 300 million units by the end of 2026.

According to global IP consultancy KnowMade, Hesai ranks No.1 worldwide in both patent volume and overall patent strength, with leading positions across key device categories including SPAD/SiPM detectors, VCSEL transmitters, and APD detectors. In the SPAD/SiPM segment, Hesai's patent portfolio is approximately twice that of Bosch, the second-ranked company, and up to forty times larger than that of other industry peers.

ETX Platform Upgraded to Full-Color Perception with 1000+ Channels

As the flagship lidar platform built on the Picasso architecture, the next-generation ETX represents a major step forward in high-performance perception. Designed for L3 and above autonomous driving, it combines longer range, higher resolution, and full-color perception in a flexible architecture with 1,080, 2,160, and up to 4,320 channels. With ultra-long-range detection and high-resolution perception, ETX enables vehicles to see farther and capture more detail across complex driving environments.

With a maximum detection range of up to 600 meters and 400 meters at 10% reflectivity, ETX delivers industry-leading performance in both range and small-object detection. It enables high-confidence identification of critical road elements at long distances, including objects as small as a 15 × 25 cm wooden block at 150 meters, significantly improving safety margins.

Built on the Picasso platform, ETX integrates Hesai's latest perception technologies to further enhance performance and reliability. These include upgraded Addressable Photon Isolation technology, advanced signal processing through the Intelligent Point Cloud Engine (IPE), and an enhanced anti-interference design, enabling more accurate signal extraction while suppressing noise and reducing false positives and false negatives compared with conventional SPAD-based approaches, significantly enhancing system safety and reliability.

ETX is expected to enter mass production in the second half of 2026, with planned deployment across multiple flagship vehicle models, supporting the large-scale adoption of L3 autonomous driving systems.

From Automotive to Robotics: Enabling the Physical AI Era

Hesai continues to lead the automotive lidar market in China and globally. According to Gasgoo Research Institute, the company held over 40% market share in 2025, ranking first in the industry, and maintained strong momentum into 2026, reaching a 51% share in February, 2.2 times that of the second-ranked player and more than three times that of the third, and extending its market leadership to 13 consecutive months. To date, Hesai has secured production design wins for more than 160 models across 40 automotive brands.

Hesai is extending its leadership beyond automotive into robotics and embodied AI, with lidar solutions deployed across applications including delivery robots, cleaning robots, automated guided vehicles (AGVs), and robotaxi platforms. The company ranks No. 1 globally across multiple robotics lidar segments and is the only lidar company named to Morgan Stanley's "Humanoid Tech 25" list.

As Physical AI systems scale globally, demand for high-performance perception continues to accelerate. Morgan Stanley estimates that lidar demand could reach 700 million units by 2050, driven by more than 1.4 billion robots, highlighting the growing role of lidar as a core enabling technology for next-generation intelligent systems.

Hesai's global capabilities form the foundation for scaling its lidar and Physical AI strategy. The company has been selected by NVIDIA as a key partner for the NVIDIA DRIVE Hyperion 10 platform. By leveraging the standardized sensor architecture of Hyperion 10, OEMs can accelerate the development and deployment of autonomous driving systems in a safer, faster, and more scalable way. Backed by clear structural advantages in scalability, quality management, and cost, Hesai has established a leading global market position. This is supported by robust product development, manufacturing, and supply chain processes, as reflected in its A-grade result in a VDA 6.3 process audit, with a 90+ audit score. Today, its lidar solutions are enabling Physical AI applications across industries in over 40 countries worldwide.

Kosmo & Robotic Actuation Modules - From Perception to Intelligence

Hesai also previewed Kosmo, a new spatial intelligence AI hardware platform scheduled for release later this year. Designed to capture the 3D world in high fidelity, bringing the physical world into the digital space for immersive and interactive experiences, Kosmo enables scalable spatial data generation and processing. It helps address the shortage of high quality real world data and accelerates the development of world models and embodied AI systems.

Kosmo powers applications across home design, robotics training and many more. In home design, it transforms real spaces into fully interactive digital environments with precise spatial measurements, allowing users to explore from any perspective, rearrange furniture, and adjust lighting in real time. In robotics training, it creates a high-fidelity digital environment where robots can explore, interact, and learn through trial and error, simulating real-world physics to accelerate embodied intelligence.

Hesai also previewed Kosmo, a new spatial intelligence AI hardware platform
Hesai also previewed Kosmo, a new spatial intelligence AI hardware platform

In addition, Hesai unveiled a new strategic direction in robotic actuation modules, core infrastructure for the era of Physical AI. The company has moved into the underlying architecture of robotic actuation modules and independently developed key technologies in this domain. As the Physical AI wave accelerates, robotics is entering a critical stage of real-world understanding and interaction. From the "eyes" of robots to their "muscles," Hesai is expanding its capabilities across intelligent robotics, autonomous driving, smart industrial systems, and broader applications, positioning itself as a key enabler of the Physical AI ecosystem.

Hesai unveiled a new strategic direction in robotic actuation modules, core infrastructure for the era of Physical AI
Hesai unveiled a new strategic direction in robotic actuation modules, core infrastructure for the era of Physical AI

This evolution reflects Hesai's broader strategic expansion from spatial perception to spatial intelligence, moving beyond helping machines sense the world to supporting how they interpret and interact with it, while enabling emerging applications such as world models, embodied intelligence, AI hardware, immersive interaction, AIGC and 4D entertainment.

 

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