Hon Hai secured its first contract to manufacture AI servers for Space Exploration Technologies Corp. (SPCX.US), with the order estimated to be worth about USD52 billion, Taiwan media reported.

SpaceX reportedly plans to deploy more than 13,000 AI server racks equipped with NVIDIA Corporation (NVDA.US) GB300 chips. Based on an estimated cost of about USD4 million per rack, the total contract value is estimated at about USD52 billion, marking Hon Hai's first AI server manufacturing order from SpaceX.

The order reportedly breaks the previous dominance of Dell Technologies Inc. (DELL.US) and Super Micro Computer, Inc. (SMCI.US) in the supply of AI servers for SpaceX.
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Despite ASML (ASML.US) and TSMC (TSM.US) delivering exceptionally strong results for 2Q26 and providing upbeat guidance, global semiconductor stocks remain under pressure, CLSA said in a report.

The PHLX Semiconductor Sector Index has ebbed back 20% from its June peak, while South Korean memory giants Samsung Electronics and SK Hynix have plunged 30% and 37%, respectively. Market concerns are centered on the sustainability of AI capex.

Furthermore, Chinese AI models such as Kimi 3 are rapidly narrowing the performance gap with top-notch US models at lower costs, which may affect demand for computing power and memory, according to recent media reports.

The broker reiterated High Conviction Outperform on SK Hynix (000660.KS), with a target price of KRW3.7 million. It also reiterated Outperform on Samsung Electronics (005930.KS) and Micron Technology, Inc. (MU.US), with target prices of KRW540,000 and USD1,700, respectively.
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HONG KONG, July 20, 2026 /PRNewswire/ -- Akeso, Inc. (9926.HK) ("Akeso" or the "Company") today announced that the first patient has been dosed in a Phase II clinical study (AK146D1-201) evaluating its internally developed TROP2/Nectin-4 bispecific antibody-drug conjugate (ADC), AK146D1, in combination with ivonescimab (the Company's PD-1/VEGF bispecific antibody) in patients with advanced non-small cell lung cancer (NSCLC). The study will explore the therapeutic potential of this combination, with a particular emphasis on the first-line treatment setting.

The advancement of ADC 2.0 candidates AK146D1 and AK138D1 into Phase II trials marks a critical milestone for Akeso's "IO2.0 + ADC2.0" strategy. Built upon our proprietary bispecific and multispecific antibody technology alongside our innovative IO2.0 portfolio, this progress underscores our commitment to elevating the standard of care for major global diseases like lung cancer. Furthermore, it reinforces our cancer therapy matrix, positioning Akeso with distinct, cross-generational competitive advantages in the global market.

In the immuno-oncology (IO) arena, Akeso stands as the only company globally with two approved bispecific antibodies for cancer immunotherapy. The Company is actively evaluating ivonescimab and cadonilimab in combination with its pipeline of proprietary next-generation ADC2.0 agents. Increasingly, global partners recognize both ivonescimab and cadonilimab as preferred agents for combination regimens and breakthrough therapy explorations across a wide spectrum of tumor types.

Within the ADC landscape, Akeso has established a pipeline of breakthrough next-generation candidates, with AK146D1, AK138D1, AK157D1, and AK158D1 (a bispecific ADC) already in clinical development. These novel agents are designed to overcome the narrow therapeutic window and safety limitations frequently observed in conventional ADCs, effectively ushering ADC therapy into a new 2.0 era.

Ivonescimab, a first-in-class PD-1/VEGF bispecific antibody, has demonstrated clinically transformative benefits compared to PD-1 inhibitor-based therapies across multiple Phase III studies, supported by a robust body of clinical evidence. AK146D1 is an ADC2.0 agent that exhibits potent antitumor activity and a favorable safety profile. The combination of AK146D1 and ivonescimab holds the potential to significantly enhance clinical efficacy, reduce treatment-related toxicity, and broaden the range of eligible patients. By addressing the multifaceted clinical limitations of conventional immunotherapy and current ADC therapies, this regimen aims to emerge as a next-generation solution that offers superior efficacy and safety for patients with cancer.

About Akeso

Akeso (HKEX: 9926.HK) is a leading biopharmaceutical company committed to the research, development, manufacturing and commercialization of the world's first or best-in-class innovative biological medicines. Founded in 2012, Akeso has built a comprehensive R&D innovation ecosystem anchored by its proprietary Tetrabody antibody technology platform, AI-powered drug R&D platform, Dual-Shield ADC technology platform, Dual-Lock T-cell engager (TCE) technology platform, Tissue-Smart siRNA/mRNA technology platform, and cell therapy technology platforms.

Backed by world-class GMP manufacturing facilities and a highly efficient, integrated commercialization system, Akeso has developed into a globally competitive biopharmaceutical enterprise. Leveraging its fully integrated, multi-functional platform, the company maintains a robust pipeline of more than 50 innovative assets targeting cancer, autoimmune diseases, inflammation, metabolic disorders, and other major therapeutic areas. Of these, 27 candidates have advanced into clinical trials—including 15 bispecific or multispecific antibodies and bispecific ADCs—and 8 innovative drugs have reached commercial stage.

Through efficient and groundbreaking R&D, Akeso integrates premier global resources to develop transformative medicines, deliver high-quality, affordable therapeutic antibodies to patients worldwide, and generate sustained commercial and societal value as it strives to become a global leader in biopharmaceutical innovation.

Forward-Looking Statements

This announcement by Akeso, Inc. (9926.HK, "Akeso") contains "forward-looking statements". These statements reflect the current beliefs and expectations of Akeso's management and are subject to significant risks and uncertainties. These statements are not intended to form the basis of any investment decision or any decision to purchase securities of Akeso. There can be no assurance that the drug candidate(s) indicated in this announcement or Akeso's other pipeline candidates will obtain the required regulatory approvals or achieve commercial success. If underlying assumptions prove inaccurate or risks or uncertainties materialize, actual results may differ materially from those set forth in the forward-looking statements.

Risks and uncertainties include but are not limited to, general industry conditions and competition; general economic factors, including interest rate and currency exchange rate fluctuations; the impact of pharmaceutical industry regulation and health care legislation in P.R.China, the United States and internationally; global trends toward health care cost containment; technological advances, new products and patents attained by competitors; challenges inherent in new product development, including obtaining regulatory approval; Akeso's ability to accurately predict future market conditions; manufacturing difficulties or delays; financial instability of international economies and sovereign risk; dependence on the effectiveness of the Akeso's patents and other protections for innovative products; and the exposure to litigation, including patent litigation, and/or regulatory actions.

Akeso does not undertake any obligation to publicly revise these forward-looking statements to reflect events or circumstances after the date hereof, except as required by law.

SK Group Chairman Chey Tae-won said global semiconductor demand will mushroom next year, with demand in the AI sector expected to rally 60-100% YoY, while overall semiconductor product demand will also climb at least 50-60%, Yonhap News Agency reported.

However, as additional supply next year is expected to be close to zero, the supply shortage situation may exacerbate further.

Last Friday (17th), the three major US stock indices came under pressure, with the Nasdaq closing down 1.4%. This morning (20th), South Korea's KOSPI traded softer, down 0.66%, while SK Hynix shares jumped up more than 2% and Samsung Electronics gained 0.4%.

Chey said the current global supply-demand situation for memory chips is almost in chaos. As various parties scramble to secure supply, the memory chip supply issue has escalated into a matter of national security.
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Anthropic is holding very preliminary discussions on leasing computing capacity from Meta Platforms, Inc. (META.US), CNBC reported, citing people familiar with the matter.

After The New York Times reported that the two sides are discussing a potential transaction valued at around USD10 billion, shares of the social media giant rebounded from intraday lows last Friday (17th).

The discussions come weeks after Anthropic announced a similar agreement with Elon Musk-owned Space Exploration Technologies Corp. (SPCX.US) to use computing capacity at its Colossus 1 data center to enhance service capacity for paid subscribers.

This highlights that Anthropic, as one of the major AI laboratories, continues to engage in large-scale collaborations with other AI labs to access AI chips produced by Nvidia.
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SHANGHAI, July 17, 2026 /PRNewswire/ -- Joyson Electronics (600699.SH/0699.HK) announced at the 2026 World Artificial Intelligence Conference (WAIC) a suite of robotic component solutions, including a dexterous robotic hand, solid-liquid hybrid battery, third-generation AI head assembly, electronic skin, and an embodied AI brain – alongside its latest achievements in industrial settings training and application. In addition, the company's robot controller products are already in volume production and being delivered to leading robotics firms.

Dexterous Robotic Hand Integrates Multiple Industry-Exclusive Technologies; AI Head Assembly Ready for Rapid Mass Production

The dexterous robotic hand is often regarded as the "crown jewel" of robotics – owing to its high level of integration across a broad range of frontier disciplines, among them bionics, flexible sensing, MEMS, and advanced materials – and its significant commercial value.

At WAIC, Joyson Electronics introduced its first fully in-house developed "TeleHand" series of dexterous hand solutions. The TeleHand Professional Edition features an industry-exclusive "in-palm integration + hybrid actuation" architecture, directly addressing key challenges such as standalone integrity, tactile sensing, compliant manipulation, and fine motion control.

With 20 degrees of freedom, the TeleHand integrates three actuation modes – direct drive, tendon-driven, and linkage – within the palm. This design not only combines the precision of direct drive with the compliance of tendon-driven mechanisms, but also delivers higher transmission efficiency and lighter weight, enabling easy adaptation to various robotic platforms.

The TeleHand is equipped with Joyson Electronics' in-house developed actuators and force-tactile sensing technologies, including:

• Ultra-compact, high-torque-density miniature frameless actuators, which reduce volume by nearly 50% and weight by approximately 30% compared to conventional models, while delivering 2–3 times higher torque density than industry-standard hollow-cup motors of the same diameter.
• In-house developed force and tactile sensing technology (electronic skin), featuring industry-exclusive natively decoupled three-dimensional force sensing, achieving resolution beyond human tactile limits, with high sensitivity, proximity detection, ultra-thin form factor, and flexibility – suitable for diverse dexterous hand and embodied intelligence applications.

The TeleHand PHINO platform's native unified multimodal fusion architecture minimizes information loss and offers strong generalization capabilities, enabling the TeleHand to perform precision industrial operations while seamlessly supporting service-oriented interactive scenarios. In addition to the Professional Edition, Joyson Electronics also launched a cost-effective Basic Edition, which offers industrial-grade reliability and real-world deployment advantages through in-house factory batch deployment.

Meanwhile, Joyson Electronics unveiled its third-generation AI head assembly, which integrates perception, motion, and system-level capabilities to deliver more natural head movements and emotional expression. Designed with a production-ready mechatronic architecture, it enables rapid support from concept design and prototype validation to mass production. Its modular and platform-based design further allows for agile product customization and iteration to meet diverse customer requirements.

Joyson Electronics Debuts Embodied AI Brain; Controllers Already Shipping to Leading Customers

In the robotics "brain" domain (cerebrum and cerebellum), Joyson Electronics' automotive-grade edge-side physical AI platform – its robot controller products – has already achieved commercial deployment and is now in volume production for leading robotics customers.

Furthermore, Joyson Electronics unveiled its embodied AI brain solution (EAOS + EAPC) – a unified, software-hardware-integrated platform designed for cross-form-factor and cross-scenario adaptability. The solution aims to make robots "easier to use, truly productive, and capable of autonomous evolution."

The Embodied AI PC (EAPC) adopts an external form-factor design, built on a fused cerebrum-cerebellum controller architecture, with computing power ranging from 40 TOPS to 2070 TFLOPS, meeting diverse requirements from entry-level to flagship embodied AI systems. The product features a modular, integrated design with a compact footprint and superior thermal efficiency, enabling cross-platform and cross-environment adaptability. Leveraging Joyson Electronics' automotive supply chain and manufacturing capabilities, the solution also offers significant cost competitiveness.

On the software side, the Embodied AI Operating System (EAOS) comprises three core subsystems:

• World Model – responsible for "understanding", encoding multimodal signals into unified state representations and using dynamic predictors to simulate and preview scenarios within the system.
• Agentic OS – responsible for "action", formulating high-level strategies, decomposing complex tasks, dynamically orchestrating sub-agents, invoking skill libraries and tools, and translating decisions into precise motions across dexterous hands, robotic arms, and mobile chassis.
• Memory System – responsible for "evolution," managing working memory for real-time context, episodic memory for past experiences, and skill memory for accumulated learned capabilities.

The EAOS enables robots to execute long-horizon, complex tasks and achieve autonomous evolution – translating into tangible productivity gains. To date, Joyson Electronics' embodied AI brain has been deployed in real-world settings, including select industrial scenarios and automated charging.

Solid-Liquid Hybrid Battery: The Optimal Power Solution for Embodied Intelligence

Conventional energy solutions for embodied intelligence face multiple challenges – limited endurance, large footprint, long recharging times, and insufficient power capacity to support instantaneous high-current discharge. Battery safety also remains a critical factor for widespread adoption. The industry requires a fundamental breakthrough that simultaneously balances energy density, power density, and safety.

Solid-liquid hybrid batteries (semi-solid-state batteries) offer the optimal power solution for embodied intelligence and represent the only technological pathway capable of addressing all the above energy challenges at the current stage. At WAIC, Joyson Electronics introduced its "Crystal Energy" multi-form solid-liquid hybrid battery solution, delivering high performance and reliability:

• Energy density significantly increased to 380 Wh/kg
• Overall endurance improved by approximately 60%
• Cycle life exceeding 2,000 cycles
• Wide operating temperature range from -20°C to 60°C
• Supports both wired and wireless charging, reaching 80% capacity in just 30 minutes

Complementing this is the Crystal Energy Ultra-Control BMS, which operates across a wide temperature range of -40°C to 105°C, featuring real-time cell monitoring, automotive-grade safety protection, and full-lifecycle health management – comprehensively enhancing the safety, durability, and energy efficiency of robotic power systems. Additionally, Joyson Electronics unveiled its first gallium nitride (GaN) motor driver, achieving conversion efficiency exceeding 95% while reducing size by 40% – positioning it at the forefront of the industry.

With robotics standing on the cusp of large-scale commercialization, Joyson Electronics is advancing its "self-development + investment" dual-drive strategy, expanding its presence in embodied intelligence, and accelerating breakthroughs in key technologies. Looking ahead, Joyson Electronics will leverage its global R&D, manufacturing capabilities, and industrial settings to drive the reliable, scalable, and cost-effective commercialization of robotic core components, helping accelerate the industry's transition to mass adoption.

上海2026年7月17日 /美通社/ -- 7月17日，均勝電子（600699.SH/0699.HK）亮相「2026世界人工智能大會（WAIC）」，發佈靈巧手、固液混合電池、第三代AI頭部總成、電子皮膚和具身智能體大腦等多個核心部件總成方案，以及機器人工業場景訓練與應用最新成果。均勝電子還宣佈，其具身智能業務正加速走向商業化落地，控制器等產品已為頭部機器人公司量產供貨。

靈巧手集成多項獨創技術，兼顧多場景應用與快速部署

靈巧手被稱為機器人領域「皇冠上的明珠」。均勝電子此次帶來首款自研「靈犀」靈巧手（TeleHand）系列解決方案，直擊獨立完整性、觸覺感知、柔順操作和精細控制等難點。

其中，首發的專業版是業內獨創的「掌內集成+混合驅動」靈巧手，具備20個自由度，掌內集成直驅、腱繩和連桿三種驅動方式。集成的微型執行器，不僅體積減半、重量減輕30%，扭矩密度高於行業競品2~3倍；自研的電子皮膚擁有全球獨創物理原生解耦的三維力感知技術，感知解析度媲美人手感知。而且，公司還推出更具性價比的基礎版，具備可靠性和快速部署優勢。

此外，靈犀PHINO平臺的原生統一多模態融合架構，使靈巧手既可完成工業精密操作，也能勝任服務多種交互場景。

第三代AI頭部總成再進化，可支援全球快速量產

均勝電子發佈的第三代AI頭部總成，集感知、運動與系統集成能力於一體，並以大語言模型加持，能實現更自然的頭部姿態與情緒表達。該頭部總成採用面向量產的機電一體化設計，能快速支援從方案設計、樣機驗證再到量產導入，並且模組化、平臺化架構優勢，讓產品能根據國內外客戶需求，快速實現產品組合與迭代。

首發具身智能體大腦，控制器已為頭部客戶供貨

在機器人「大腦」領域，均勝電子車規級端側物理AI平臺的中央控制器，近日已為頭部機器人客戶規模化量產供貨。

此次，均勝電子還推出具身智能體大腦解決方案（EAOS+EAPC），具備「一腦多形、軟硬一體、全場景適配」的優勢，近期已在部分工業場景、自動充電等場景實現真實部署運行。

該方案的主機基於大小腦融合控制器，算力覆蓋40TOPS至2070 TFLOPS，結構尺寸更小、功耗散熱更佳，可以跨本體、跨場景適配。配套的作業系統，集成世界模型、Agentic OS和Memory系統，分別負責基於模型和動力學預測器在「腦內」預演世界，基於作業系統把決策轉換成靈巧手、機械臂等部件的動作，以及機器人的學習記憶和進化。EAOS不僅能讓機器人完成長程複雜任務，還能使機器人自主進化，轉化為真實生產力。

固液混合電池，具身智能動力最優解決方案

針對智能體能源的續航時間短、佔據空間大、補能時間長等痛點，均勝電子推出均恩固液混合電池包系列，率先在能量密度、功率密度與安全性等方面取得突破，成為現階段能同時解決上述痛點的最優技術路線。同期發佈的還有機器人雙向無線補能解決方案、高密度能量轉換器等新產品。

目前，公司已打造全場景能源解決方案。其中，首發的固液混合電池包能量密度大幅提高至380 Wh/kg，綜合續航提升約60%，循環壽命達2000+次，可在-20~60°C寬溫域運行，支援有線、無線充電，30分鐘即可充至80%電量。配套的均恩晶能超控BMS，能在-40~105°C寬溫域運行，全面提升能源安全性、耐久性與能效。

當前，機器人正處在大規模量產前夜，均勝電子通過「自研+投資」雙輪驅動，持續佈局具身智能領域，加速關鍵技術突破。均勝將依託全球研發、智造能力與工業場景優勢，推動機器人核心部件高可靠、規模化、低成本落地，助力產業邁向規模化應用新階段。

The Shanghai Composite Index lost 63 points or 1.6% at midday to 3,818, hitting a more than three-and-a-half-month trough since late March, with turnover of RMB744.24 billion. The Shenzhen Component Index dived 535 points or 3.7% to 13,953, marking a more than three-month low, with turnover of RMB858.074 billion. The ChiNext Index slid 173 points or 4.7% to 3,518, reaching an about three-month trough, with turnover of RMB402.891 billion.

Major banking stocks bucked the market trend. ICBC (601398.SH) rose nearly 1%, while CCB (601939.SH) climbed 2.9%. CMB (600036.SH) gained nearly 1%. CHINA LIFE (601628.SH) rose nearly 0.9%. PING AN OF CHINA (601318.SH) added 0.6%. BYD Company (002594.SZ) fell 0.7%, while CONTEMPORARY AMPEREX (300750.SZ) edged up 0.1%.

Chip stocks came under selling pressure. SMIC (688981.SH) lost 2%, while HUA HONG GRACE (688347.SH) dipped 0.2%. AI chip stock CAMBRICON (688256.SH) tumbled 5.7%. METAX (688802.SH) plunged 9.4%.

LQKJ (688008.SH) continued to plunge 9% by midday. The company forecast 1H26 net profit of about RMB1.9 billion to RMB2.1 billion, representing a YoY increase of about 63.9% to 81.2%. The company plans to repurchase A-shares involving RMB300 million to RMB600 million. Regarding the investigation into potential antitrust-related violations by the Fair Trade Investigation Department of the Seoul Central District Prosecutors' Office in South Korea, authorities conducted an on-site search and evidence collection at the group's South Korea office on the previous day (15th). The group said it is fully cooperating with prosecutors' requests. The company stated that none of the Group, its directors and employees has been charged by the PO or any government authorities with any wrongdoing. The Group’s business operations remain normal and the Group remains fully focused on products research and development, as well as serving its customers.
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Apple Inc. (AAPL.US) is preparing the biggest upgrade for the iPad mini in five years, with the device set to adopt an OLED display for the first time, Bloomberg, citing sources, reported.

The launch is expected as early as this autumn, with plans to release it before October. In addition, Apple plans to launch an entry-level iPad and an upgraded iPad Air next year.
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NVIDIA (NVDA.US) announced on Wednesday a new AI model, Cosmos 3 Edge, for robotics and visual AI agents, further advancing its presence in Japan's physical AI market.

The company said Cosmos 3 Edge belongs to the category of so-called world models, designed to help systems perceive and navigate physical environments in real time. Compared with large language models (LLMs), world models can learn from a broader range of inputs. The launch comes shortly after the release of Cosmos 3 in May.

During NVIDIA CEO Jensen Huang's two-day visit to Japan, regional expansion became a key focus. According to NVIDIA, the company is forming an alliance, with Japanese industrial giants including Fujitsu, Hitachi and Kawasaki Heavy Industries expressing interest in joining to expand its physical AI footprint.

Huang said in a statement on Wednesday that the next frontier of AI lies in the physical world, representing a once-in-a-generation opportunity for Japan. He noted that Japan invented modern manufacturing and now has the opportunity to reshape the industry for the intelligent industrial era.
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